Custom components for semiconductor process equipment

Semiconductor components.
Made to your drawing.

Quartz, silicon, ceramic and SiC components developed around your drawing, equipment conditions and acceptance criteria — from feasibility review to customer qualification.

Representative WONIK quartz wafer boat
Multi-material

Quartz, silicon, ceramic and SiC development options

Drawing-led

Evaluation against customer-controlled technical inputs

Qualification

DFM, prototype and first-article planning

Lifecycle

New parts, refurbishment and spare-part support

Why WONIK

A direct route from part need to customer qualification.

WONIK Semicon combines component engineering, integrated production and lifecycle services to help fabs and equipment partners evaluate alternative sources for critical hard-brittle components.

Quartz · 石英Silicon · 硅Ceramic · 陶瓷SiC · 碳化硅
01

Drawing & sample review

Engineering evaluation based on a customer drawing, reference sample or agreed specification.

02

Integrated manufacturing

Cold machining, flame working, cleaning and inspection managed through one production flow.

03

Defined quality route

Material, inspection, cleaning and packaging criteria aligned with the agreed acceptance specification.

04

Lifecycle support

Repair, refurbishment and buffer-stock programs designed to reduce cost and unplanned downtime.

Product portfolio

Find the right product family faster.

Browse full product directory

Explore component categories. Search and filter by material, process or size in the product directory.

Need a non-standard component?

Send a drawing or sample for feasibility review and a controlled development plan.

Discuss a custom part

Semiconductor applications

Start with the process, then define the part.

These are representative application directions—not statements of compatibility with a specific tool. Final suitability depends on the drawing, material, process conditions and customer qualification.
01Review required

Thermal processing

Oxidation · Diffusion · Annealing

Quartz or SiC wafer boats, process tubes, gas-delivery and thermal-support components.

Confirm before quotation

Wafer size, furnace type, temperature profile, atmosphere and cleanliness criteria.

02Review required

Deposition

CVD · LPCVD

Process tubes, chambers, injectors, baffles, carriers and custom quartz assemblies.

Confirm before quotation

Film process, gases, pressure, temperature, interface and cleaning specification.

03Review required

Wet processing

Cleaning · Wet etch · Resist strip

Quartz tanks, overflow and circulation vessels, flow-control and support components.

Confirm before quotation

Chemistry, concentration, temperature, capacity, circulation and leak requirements.

04Review required

Dry etching

Plasma etch · Chamber support

Quartz or silicon rings, windows, baffles, shields and ceramic positioning parts.

Confirm before quotation

Chamber, plasma chemistry, wafer size, material grade and qualification standard.

05Review required

Epitaxy

Application review

Quartz chambers, gas-delivery, flow-control, window and carrier components.

Confirm before quotation

Material system, equipment, gases, temperature, coatings and particle criteria.

06Review required

Equipment lifecycle

Repair · Refurbishment · Spare support

Feasibility review for serviceable quartz parts and agreed spare-part programs.

Confirm before quotation

Part condition, drawing revision, failure mode, acceptance and demand profile.

WONIK Semicon facility
10,000+ m²Production facility
67Machining assets

Facility and equipment figures: 2026 company introduction. Project capabilities are subject to technical review.

Quality infrastructure

Qualification starts with the right criteria.

From material documentation and dimensional inspection to cleaning and final packaging, the route is defined around the part, application and agreed acceptance criteria.

Material documentationGrade, batch and CoA requirements aligned before production
Dimensional inspectionCritical dimensions, datums, surface finish and methods agreed in advance
Cleaning & packagingHandling and packaging route defined by the product specification
FAIfirst-article inspection planning
CoAwhen agreed by specification

WONIK · Our factory

Inside WONIK manufacturing

WONIK Semicon Co., Ltd. has companies in Wuxi and Lianyungang. Our factory brings together CNC machining, quartz flame working, dimensional inspection and cleaning to support semiconductor component production.

WONIK · CNC machining

CNC machining

Machining centres support cutting, grinding and polishing of quartz components.

WONIK · Quartz flame working

Quartz flame working

Glass lathes and flame-working stations support forming and welding of quartz parts.

WONIK · Dimensional inspection

Dimensional inspection

Vision measurement equipment supports dimensional checks against component drawings.

WONIK · Cleaning & packing area

Cleaning & packing area

Automated cleaning equipment supports the cleaning stage before final packing.

Factory photographs: WONIK company introduction, 2026, pages 5–8. Processing routes, cleanliness requirements and acceptance criteria are confirmed for each project.

A clear qualification path

From reference part to repeatable supply.

A controlled route from technical inputs through engineering, prototype production and qualification.

01

Define

Sample or drawing, material, equipment and process requirements.

02

Engineer

Measure, model and agree critical dimensions and acceptance criteria.

03

Build

Produce a prototype through the agreed manufacturing route.

04

Qualify & supply

Inspect, clean and package for customer evaluation, then plan repeat supply.

Start a technical conversation

Bring us the part your process depends on.

For a faster feasibility review, prepare the equipment family, part drawing or sample, material grade, critical tolerances, cleaning requirement and estimated annual demand.

WONIK Semicon Co., Ltd. · Wuxi / Lianyungang. Choose the contact channel for your business region.